MSM82C43 Ver la hoja de datos (PDF) - Oki Electric Industry

Número de pieza

componentes Descripción

Fabricante

MSM82C43

INPUT/OUTPUT PORT EXPANDER

Oki Electric Industry 

¡ Semiconductor

PACKAGE DIMENSIONS

DIP24-C-600-2.54

24

13

MSM82C43

(Unit : mm)

1

12

INDEX MARK

30.8MAX

1.27TYP

15.24

1.27TYP

2.54

0.50±0.10

0.25 M

SEATING PLANE

+0.15

0.25-0.05

Notes for Mounting the Surface Mount Type Package

The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which

are very susceptible to heat in reflow mounting and humidity absorbed in storage.

Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the

product name, package name, pin number, package code and desired mounting conditions

(reflow method, temperature and times).

12/13

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