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MAX2117EVKIT

MAX2117 Evaluation Kit

Maxim Integrated 

MAX2117 Evaluation Kit

Evaluates: MAX2117

Layout Considerations

The EV kit can serve as a guide for PCB layout. Keep RF

signal lines as short as possible to minimize losses and

radiation. Use controlled impedance on all high-frequency

traces. The exposed paddle must be soldered evenly to

the board’s ground plane for proper operation. Use abun-

dant vias beneath the exposed paddle for maximum heat

dissipation. Use abundant ground vias between RF traces

to minimize undesired coupling.

To minimize coupling between different sections of the

IC, the ideal power-supply layout is a star configuration,

which has a large decoupling capacitor at the central

VCC node. The VCC traces branch out from this node,

with each trace going to separate VCC pins of the IC.

Each VCC pin must have a bypass capacitor with a low

impedance to ground at the frequency of interest. Do not

share ground vias among multiple connections to the

PCB ground plane.

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