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LX5503 Datasheet PDF : 13 Pages
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LX5503
TM
®
InGaP HBT 5-6GHz Power Amplifier
PRODUCTION DATA SHEET
ABSOLUTE MAXIMUM RATINGS
DC Supply Voltage, RF off ...............................................................................6V
Collector Current ........................................................................................500mA
Total Power Dissipation...................................................................................3 W
RF Input Power........................................................................................... 10dBm
Operation Ambient Temperature ....................................................... -40 to +85oC
Storage Temperature........................................................................ -65 to +150oC
Peak Package Solder Reflow Temp (40 seconds maximum exposure) .......... 260°C (+0,-5)
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal.
PACKAGE PIN OUT
13 14 15 16
12
1
11
2
10
3
9
4
87 65
LQ PACKAGE
(Bottom View)
RoHS / Pb-free 100% Matte Tin Lead Finish
Pin Name
RF IN
Vb1
Vb2
Vcc
RF OUT
Vc1
Vc2
GND
Pin Number
2, 3
6
7
9
10, 11
15
14
FUNCTIONAL PIN DESCRIPTION
Description
RF input for the power amplifier. This pin is DC-shorted to GND but AC-coupled to the transistor
base of the first stage. For 5.15-5.35GHz this pin is pre-matched to 50Ω.
Bias current control voltage for the first stage.
Bias current control voltage for the second stage. The VB2 pin can be connected with the first
stage control voltage (VB1) into a single reference voltage (referred to as Vref) through an
external resistor bridge(R1/R2).
Supply voltage for the bias reference and control circuits. The VCC feed line should be
terminated with a 1 μF bypass capacitor as close to the device as possible. This pin can be
combined with both VC1 and VC2 pins, resulting in a single supply voltage (referred to as Vc).
RF output for the power amplifier. This pin is AC-coupled and does not require a DC-blocking
capacitor.
Power supply for first stage amplifier. The VC1 feedline should be terminated with a 220pF
bypass capacitor as close to the device as possible, followed by a 1μF bypass capacitor at the
supply side. This pin can be combined with VC2 and VCC pins, resulting in a single supply
voltage (referred to as Vc).
Power supply for second stage amplifier. The VC2 feedline should be terminated with a 220pF
bypass capacitor as close to the device as possible, followed by a 1 μF bypass capacitor at the
supply side. This pin can be combined with VC1 and VCC pins, resulting in a single supply
voltage (referred to as Vc).
The center metal base of the MLP package provides both DC and RF ground as well as heat
sink for the power amplifier.
Copyright © 2000
Rev. 1.2d, 8/18/2005
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
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