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E-LIS3L02AS5TR Ver la hoja de datos (PDF) - STMicroelectronics

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E-LIS3L02AS5TR Datasheet PDF : 14 Pages
First Prev 11 12 13 14
5 Package Information
5 Package Information
LIS3L02AS5
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages.
These packages have a Lead-free second level interconnect. The category of second Level
Interconnect is marked on the package and on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 5. SO24 Mechanical Data & Package Dimensions
DIM.
MIN.
mm
TYP. MAX. MIN.
inch
TYP. MAX.
A 2.35
2.65 0.093
0.104
OUTLINE AND
MECHANICAL DATA
A1 0.10
0.30 0.004
0.012
B 0.33
0.51 0.013
0.200
C 0.23
0.32 0.009
0.013
D (1) 15.20
15.60 0.598
0.614
E 7.40
7.60 0.291
0.299
e
1.27
0.050
H 10.0
10.65 0.394
0.419
h
0.25
0.75 0.010
0.030
L
0.40
1.27 0.016
0.050
k
0˚ (min.), 8˚ (max.)
ddd
0.10
0.004
(1) “D” dimension does not include mold flash, protusions or gate
burrs. Mold flash, protusions or gate burrs shall not exceed
Obsolete Product(s) - 0.15mmperside.
Weight: 0.60gr
Obsolete Product(s) SO24
12/14
0070769 C

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