UPC2711T Ver la hoja de datos (PDF) - Renesas Electronics

Número de pieza

componentes Descripción

Fabricante

UPC2711T

BIPOLAR ANALOG INTEGRATED CIRCUIT

Renesas Electronics 

µPC3215TB

NOTES ON CORRECT USE

(1) Observe precautions for handling because of electro-static sensitive devices.

(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).

(3) Keep the track length of the ground pins as short as possible.

(4) A low pass filter must be attached to VCC line.

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered under the following recommended conditions. For soldering methods and

conditions other than those recommended below, contact your NEC sales representative.

Soldering Method

Infrared Reflow

VPS

Wave Soldering

Partial Heating

Soldering Conditions

Package peak temperature: 235°C or below

Time: 30 seconds or less (at 210°C)

Count: 3, Exposure limit: NoneNote

Package peak temperature: 215°C or below

Time: 40 seconds or less (at 200°C)

Count: 3, Exposure limit: NoneNote

Soldering bath temperature: 260°C or below

Time: 10 seconds or less

Count: 1, Exposure limit: NoneNote

Pin temperature: 300°C

Time: 3 seconds or less (per side of device)

Exposure limit: NoneNote

Recommended Condition Symbol

IR35-00-3

VP15-00-3

WS60-00-1

–

Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period.

Caution Do not use different soldering methods together (except for partial heating).

For details of recommended soldering conditions for surface mounting, refer to information document

SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).

Data Sheet P14765EJ2V0DS00

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