MD3S Ver la hoja de datos (PDF) - Daesan Electronics Corp.
Número de pieza
componentes Descripción
Fabricante
MD3S Datasheet PDF : 2 Pages
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MD1S THRU MD7S
CURRENT 0.5 Amperes
VOLTAGE 50 to 1000 Volts
Features
· Glass Passivated Die Construction
· Diffused Junction
· Low Forward Voltage Drop, High Current Capability
· Surge Overload Rating to 30A Peak
· Designed for Printed Circuit Board Applications
· Plastic Material - UL Flammability Classification 94V-0
L
AB
G
DE
Mechanical Data
· Case : Molded Plastic
· Terminals : Solder Plated Leads,
Solderable per MIL-STD-202, Method 2026
· Polarity : As Marked on Case
· Approx. Weight : 0.125 grams
· Mounting Position : Any
· Marking : Type Number
H
J
K
C
MiniDIP
Dim Min Max
A
5.43 5.75
B
3.60 4.00
C
0.15 0.35
D
0.05 0.20
E
7.00
G
0.70 1.10
H
4.50 4.90
J
2.80 2.90
K
2.50 2.70
L
0.50 0.80
All Dimens ions in mm
Maximum Ratings And Electrical Characteristics
(Ratings at 25℃ ambient temperature unless otherwise specified, Single phase, half wave 60Hz, resistive or inductive
load. For capacitive load, derate by 20%)
Symbols MD1S MD2S MD3S MD4S MD5S MD6S MD7S
Peak Repetitive Reverse voltage
Working Peak Reverse voltage
DC Blocking voltage
RMS Reverse voltage
Maximum DC blocking voltage
Average Rectified Output Current @ TA=40℃
Non-Repetitive Peak Forward Surge Current,
8.3ms single half-sine-wave superimposed
on rated load (JEDEC method)
Forward voltage (per element)
@ IF=0.4 A
Peak Reverse Current at Rated
@ TA=25℃
DC Blocking voltage (per element) @ TA=100℃
Typical Thermal Resistance,
Junction to Ambient (Note 2)
Operating and Storage Temperature Range
VRMM
VRWM
VR
VRMS
VDC
Io
IFSM
VFM
IRM
RθJA
Tj
TSTG
50
100 200 400 600 800 1000
35
70
140 280
420 560
700
50
100 200 400 600 800 1000
0.5
30
1.0
5.0
500
75
-55 to +150
Notes:
(1) Mounted on P.C. Board.
(2) Thermal resistance junction to ambient.
Units
Volts
Volts
Volts
Amp
Amps
Volts
μA
℃/W
℃
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