594D107X_010C2T Ver la hoja de datos (PDF) - Analog Devices
Número de pieza
componentes Descripción
Fabricante
594D107X_010C2T Datasheet PDF : 22 Pages
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ADN8830
OUTLINE DIMENSIONS
PIN 1
INDICATOR
0.80
0.75
0.70
SEATING
PLANE
5.10
5.00 SQ
4.90
TOP VIEW
0.50
BSC
0.30
0.25
0.18
25
32
24
1
EXPOSED
PAD
PIN 1
INDICATOR
3.25
3.10 SQ
2.95
17
8
0.50
16
9
0.25 MIN
0.40
BOTTOM VIEW
0.30
0.05 MAX
0.02 NOM
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COPLANARITY
0.08
0.20 REF
ORDERING GUIDE
Model1
ADN8830ACPZ
ADN8830ACPZ-REEL
ADN8830ACPZ-REEL7
COMPLIANT TO JEDEC STANDARDS MO-220-WHHD.
Figure 26. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
5 mm × 5 mm Body, Very Very Thin Quad
(CP-32-7)
Dimensions shown in millimeters
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
1 Z = RoHS Compliant Part.
Package Option
CP-32-7
CP-32-7
CP-32-7
REVISION HISTORY
3/12—Rev. C to Rev. D
Added EPAD Notation .....................................................................3
Updated Outline Dimensions........................................................22
Changes to Ordering Guide...........................................................22
11/03—Rev. B to Rev. C
Changes to Ordering Guide.............................................................3
Deleted Figure 24 ............................................................................21
Deleted Boosting the Output Voltage section .............................22
Deleted Figure 26 ............................................................................22
Deleted Equations 45, 46 and 47 ...................................................22
Updated Outline Dimensions........................................................23
8/03—Rev. A to Rev. B
Updated Ordering Guide ................................................................. 3
Updated Thermal Setup Section ..................................................... 8
Updated Outline Dimensions........................................................23
2/03—Rev. 0 to Rev. A
Renumbered Figures.......................................................... Universal
Changes to Thermistor Setup Section............................................8
Changes to Figure 14 ......................................................................15
Changes to Figure 23 ......................................................................20
Changes to Figure 25 ......................................................................21
Updated Outline Dimensions........................................................23
©2012 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D02793-0-3/12(B)
–22–
REV. D
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