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HLMP-C008 Ver la hoja de datos (PDF) - Avago Technologies

Número de pieza
componentes Descripción
Fabricante
HLMP-C008
AVAGO
Avago Technologies AVAGO
HLMP-C008 Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
Example of Wave Soldering Temperature Profile for TH LED
TURBULENT WAVE
LAMINAR
250
HOT AIR KNIFE
200
150
100
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.
50
PREHEAT
0
10 20 30 40 50 60 70 80 90 100
TIME (MINUTES)
Ammo Packs Drawing
9

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