CDA6C05GTH Ver la hoja de datos (PDF) - EPCOS AG

Número de pieza

componentes Descripción

Fabricante

CDA6C05GTH

CeraDiodes High-speed series

EPCOS AG 

CeraDiodes

High-speed series

5.7 Placement of components on circuit board

It is of advantage to place the components on the board before soldering so that their two termi-

nals do not enter the solder oven at different times. Ideally, both terminals should be wetted si-

multaneously.

5.8 Soldering caution

Sudden heating or cooling of the component results in thermal destruction by cracks.

An excessively long soldering time or high soldering temperature results in leaching of the out-

er electrodes, causing poor adhesion due to loss of contact between electrodes and termina-

tion.

Avoid manual soldering with a soldering iron.

Wave soldering must not be applied for CeraDiodes designated for reflow soldering only.

Keep to the recommended down-cooling rate.

5.9 Standards

CECC 00802

IEC 60068-2-58

IEC 60068-2-20

JEDEC J-STD-020D

Please read Cautions and warnings and

Important notes at the end of this document.

Page 17 of 22

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