CAV24C02YE-GT3 Ver la hoja de datos (PDF) - ON Semiconductor
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CAV24C02YE-GT3 Datasheet PDF : 19 Pages
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SCALE 4:1
WLCSP5, 0.86x0.84
CASE 567DD
ISSUE D
DATE 14 JUL 2016
E
PIN A1
ÈÈÈÈ REFERENCE
AB
D
TOP VIEW
0.05 C
A
A2
5X
0.05 C
NOTE 3
SIDE VIEW A1
C
SEATING
PLANE
5X b
0.05 C A B C
0.03 C NOTE 4 B
A
e
e1
PIN A1
1 23
REFERENCE
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
A1
PACKAGE
OUTLINE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DATUM C, THE SEATING PLANE, IS DEFINED BY THE
SPHERICAL CROWNS OF THE CONTACT BALLS.
4. COPLANARITY APPLIES TO SPHERICAL CROWNS
OF THE CONTACT BALLS.
5. DIMENSION b IS MEASURED AT THE MAXIMUM
CONTACT BALL DIAMETER PARALLEL TO DATUM C.
MILLIMETERS
DIM MIN NOM MAX
A
−−−
−−− 0.39
A1 0.10 0.12 0.14
A2
0.23 REF
b 0.14 0.16 0.18
D 0.84 0.86 0.88
E 0.82 0.84 0.86
e
0.30 BSC
e1
0.52 BSC
GENERIC
MARKING DIAGRAM*
X
YM
X = Specific Device Code
Y = Year
M = Date Code
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
0.52
PITCH
5X
0.16
0.30
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER: 98AON56899E
Electronic versions are uncontrolled except when
STATUS: ON SEMICONDUCTOR STANDARD
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, 2D0E0S2 C− ReIPv.T0ION: WLCSP5, 0.86X0.84
“CONTROLLED COPY” in red.
http://onsemi.com
1
Case Outline Number:
PAGE 1 OFX2XX
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