CAV24C02 Ver la hoja de datos (PDF) - ON Semiconductor
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CAV24C02 Datasheet PDF : 19 Pages
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SCALE 4:1
WLCSP4, 0.84x0.86
CASE 567DC
ISSUE F
DATE 14 Jul 2016
PIN A1
REFERENCE
E
È
AB
D
TOP VIEW
DETAIL A
0.05 C
0.05 C
A1
NOTE 4
SIDE VIEW
OPTIONAL
BACKSIDE COAT
A
C
SEATING
PLANE
NOTE 3
4X b
0.05 C A B
B
0.03 C NOTE 5
A
e
e
12
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
A1
PACKAGE
OUTLINE
A3
A2
DETAIL A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DATUM C, THE SEATING PLANE, IS DEFINED BY
THE SPHERICAL CROWNS OF THE CONTACT
BALLS.
4. COPLANARITY APPLIES TO SPHERICAL CROWNS
OF THE CONTACT BALLS.
5. DIMENSION b IS MEASURED AT THE MAXIMUM
CONTACT BALL DIAMETER PARALLEL TO DATUM C.
MILLIMETERS
DIM MIN NOM MAX
A
−−− −−− 0.38
A1 0.08 0.10 0.12
A2
0.23 REF
A3
0.025 REF
b 0.16 0.18 0.20
D 0.82 0.84 0.86
E 0.84 0.86 0.88
e
0.40 BSC
GENERIC
MARKING DIAGRAM*
X
YM
X = Specific Device Code
Y = Year
M = Date Code
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
0.40
PITCH
4X
0.18
0.40
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER: 98AON56821E
Electronic versions are uncontrolled except when
STATUS: ON SEMICONDUCTOR STANDARD
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, 2D0E0S2 C− ReIPv.T0ION: WLCSP4, 0.84X0.86
“CONTROLLED COPY” in red.
http://onsemi.com
1
Case Outline Number:
PAGE 1 OFX2XX
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