ADM1026JST-REEL Ver la hoja de datos (PDF) - ON Semiconductor
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ADM1026JST-REEL Datasheet PDF : 55 Pages
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ADM1026
PACKAGE DIMENSIONS
PIN 1
CORNER
1
T
E
E/2
12
H
Y
SEATING
PLANE
D/2
48
D
Z 37
13
24
D1/2
D1
4X
0.2 H T-U Z
e/2
44 X e
q1
TOP & BOTTOM
48 LEAD LQFP, 7x7, 0.5P
CASE 932AA−01
ISSUE A
4X
0.2 Y T-U Z
DETAIL K
e/2
36
U
E1
E1/2
25
NOTE 9
GG
T, U, Z
DETAIL K
BASE METAL
PLATING
DETAIL F
ÇÇÇÇÇÇÉÉÉÇÇÇÉÉÉÇÇÇÉÉÉ 0.08 Y
c1 c
48 X b
b1
b
0.08 M Y T-U Z
SECTION G−G
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
3. DATUM PLANE H IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS T, U, AND Z TO BE DETERMINED AT
DATUM PLANE H.
5. DIMENSIONS D AND E TO BE DETERMINED AT
SEATING PLANE Y.
6. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 PER SIDE. DIMENSIONS D1 AND E1 DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE H.
7. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE b DIMENSION TO EXCEED 0.350.
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076.
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
MILLIMETERS
DIM MIN MAX
A
1.4
1.6
A1 0.05 0.15
A2 1.35 1.45
b 0.17 0.27
b1 0.17 0.23
c 0.09 0.20
c1 0.09 0.16
D
9.0 BSC
D1
7.0 BSC
e
0.5 BSC
E
9.0 BSC
E1
7.0 BSC
L
0.5
0.7
L1
1.0 REF
R 0.15 0.25
S
0.2 REF
q
1_ 5 _
q1
12 REF
R
A A2
(S)
A1
DETAIL F
L
(L1)
0.250
q GAUGE PLANE
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ADM1026/D
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