MG65PB16 Ver la hoja de datos (PDF) - Oki Electric Industry
Número de pieza
componentes Descripción
Fabricante
MG65PB16 Datasheet PDF : 22 Pages
| |||
s MG63P/64P/65P s ––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
Oki’s boundary scan methodology meets the JTAG Boundary Scan standard, IEEE 1149.1-1990. Oki sup-
ports boundary scan on both Sea of Gates (SOG) and Customer Structured Array (CSA) ASIC technolo-
gies. Either the customer or Oki can perform boundary-scan insertion. More information is available in
Oki’s JTAG Boundary Scan Application Note. (Contact the Oki Application Engineering Department for
interface options.)
PACKAGE OPTIONS
TQFP, LQFP and QFP Package Menu (Preliminary)
Base Array
\
Body Size (mm)
Lead Pitch (mm)
Product Name
MG6xPB02
MG6xPB04
MG6xPB06
MG6xPB08
MG6xPB10
MG6xPB12
MG6xPB14
MG6xPB16
MG6xPB18
MG6xPB20
MG6xPB22
MG6xPB24
MG6xPB26
MG6xPB28
MG6xPB30
MG6xPB32
MG6xPB34
MG6xPB36
MG6xPB38
MG6xPB40
MG6xPB42
I/O Pads [1]
68
108
148
188
228
268
308
348
388
428
468
508
548
588
628
668
708
748
788
828
868
LQFP
144
176
q
q
q
q
q
q
q
q
q
q
q
q
q
q
q
q
20 x 20
0.5
q
q
q
q
q
q
q
q
q
q
q
q
q
q
q
24 x 24
0.5
1. I/O Pads can be used for input, output, bi-directional, power, or ground.
q = Available now
208
q
q
q
q
q
q
q
q
q
q
q
q
q
q
q
q
q
28 x 28
0.5
QFP
208
240
q
q
q
q
q
q
q
q
q
q
q
q
q
q
q
q
q
28 x 28
0.5
q
q
q
q
q
32 x 32
0.5
TQFP
100
q
q
q
q
q
q
q
q
q
q
q
q
q
14 x 14
0.5
16
Oki Semiconductor
Share Link: 