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FC0402E2000DTT5 Ver la hoja de datos (PDF) - Vishay Semiconductors

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componentes Descripción
Fabricante
FC0402E2000DTT5 Datasheet PDF : 6 Pages
1 2 3 4 5 6
www.vishay.com
FC
Vishay Dale Thin Film
TYPICAL HIGH FREQUENCY PERFORMANCE ELECTRICAL MODEL AND TESTING
C
LC
R
L
C: Internal shunt capacitance
L : Internal inductance
R: Resistance
LC: External connection inductance
Cg: External capacitance to ground
LC
Cg
Cg
Lumped Equivalent Circuit
Reference plane is at the resistor-bonding pad interface.
The lumped circuit above was used to model the data at the bonding pad-resistor reference plane. High frequency testing was
performed by Modelithics, Inc. on parts mounted to quartz test boards. Quartz test boards were chosen to minimize the
contribution of the board effects at high frequencies.
INTERNAL IMPEDANCE
0402 Flip chip
1.8
C = 0.0262 pF
1.6 L = 0.00189 nH
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.1
1
0402 Wraparound
1.8
C = 0.0392 pF
1.6 L = 0.1209 nH
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.1
1
0603 Flip chip
50 Ω
75 Ω
100 Ω
1000 Ω
250 Ω
500 Ω
10 Frequency (GHz)
1.8
C = 0.0403 pF
1.6 L = 0.0267 nH
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.1
1
50 Ω
75 Ω
100 Ω
1000 Ω
500 Ω
10 Frequency (GHz)
50 Ω
100 Ω
250 Ω
1000 Ω
500 Ω
10 Frequency (GHz)
Revision: 05-Mar-18
3
Document Number: 60093
For technical questions, contact: thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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