AD5721 Ver la hoja de datos (PDF) - Analog Devices
Número de pieza
componentes Descripción
Fabricante
AD5721 Datasheet PDF : 31 Pages
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Data Sheet
AD5761/AD5721
OUTLINE DIMENSIONS
PIN 1
INDICATOR
0.80
0.75
0.70
SEATING
PLANE
3.10
3.00 SQ
2.90
TOP VIEW
SIDE VIEW
0.50
BSC
0.30
0.23
0.18
13
12
DETAIL A
(JEDEC 95)
16
1
PIN 1
INDICATOR AREA OPTIONS
(SEE DETAIL A)
EXPOSED
PAD
1.75
1.60 SQ
1.45
9
4
0.50
0.40
0.30
8
5
BOTTOM VIEW
0.20 MIN
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-WEED-6.
Figure 68. 16-Lead Lead Frame Chip Scale Package [LFCSP]
3 mm × 3 mm Body and 0.75 mm Package Height
(CP-16-22)
Dimensions shown in millimeters
5.10
5.00
4.90
16
9
4.50
4.40
6.40
BSC
4.30
1
8
PIN 1
1.20
0.15
MAX
0.20
0.05
0.09
0.75
0.30
8°
0.60
0.65
BSC
0.19 SEATING
PLANE
0°
0.45
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
ORDERING GUIDE
Model1
Resolution (Bits)
Figure 69. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
Temperature Range INL (LSB) Package Description
Package Option
AD5721BCPZ-RL7 12
AD5721BRUZ
12
AD5721BRUZ-RL7 12
AD5761ACPZ-RL7 16
AD5761BCPZ-RL7 16
AD5761ARUZ
16
AD5761ARUZ-RL7 16
AD5761BRUZ
16
AD5761BRUZ-RL7 16
−40°C to +125°C
±0.5
−40°C to +125°C
±0.5
−40°C to +125°C
±0.5
−40°C to +125°C
±8
−40°C to +125°C
±2
−40°C to +125°C
±8
−40°C to +125°C
±8
−40°C to +125°C
±2
−40°C to +125°C
±2
16-Lead LFCSP
16-Lead TSSOP
16-Lead TSSOP
16-Lead LFCSP
16-Lead LFCSP
16-Lead TSSOP
16-Lead TSSOP
16-Lead TSSOP
16-Lead TSSOP
CP-16-22
RU-16
RU-16
CP-16-22
CP-16-22
RU-16
RU-16
RU-16
RU-16
Marking Code
DHP
DN8
DHQ
1 Z = RoHS Compliant Part.
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registered trademarks are the property of their respective owners.
D12640-0-1/18(C)
Rev. C | Page 31 of 31
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