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HAL740SF-K Ver la hoja de datos (PDF) - Micronas

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HAL740SF-K Datasheet PDF : 22 Pages
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HAL700, HAL740
DATA SHEET
3.6. Characteristics
at TJ = 40 °C to +140 °C, VDD = 3.8 V to 24 V, GND = 0 V.
at Recommended Operation Conditions if not otherwise specified in the column “Conditions”.
Typical Characteristics for TJ = 25 °C and VDD = 5 V.
Symbol
IDD
IDD
VDDZ
VOZ
VOL
VOL
IOH
IOH
fosc
ten(O)
tr
tf
RthJSB
case
SOT89B-2
Parameter
Supply Current
Supply Current
over Temperature Range
Overvoltage Protection
at Supply
Overvoltage Protection
at Output
Output Voltage
Output Voltage over
Temperature Range
Output Leakage Current
Pin No.
1
1
Min.
3
2
1
2, 3
2, 3
2, 3
2, 3
Output Leakage Current over
2, 3
Temperature Range
Internal Sampling Frequency over
100
Temperature Range
Enable Time of Output after
1
Setting of VDD
Output Rise Time
2, 3
Output FallTime
2, 3
Thermal Resistance Junction
to Substrate Backside
Typ.
5.5
7
28.5
28
130
130
0.06
150
50
0.2
0.2
150
Max. Unit
9
mA
10
mA
32
V
32
V
280
mV
400
mV
0.1
μA
10
μA
kHz
μs
μs
μs
200
K/W
Test Conditions
TJ = 25 °C
IDD = 25 mA, TJ = 25 °C, t = 2 ms
IO = 20 mA, TJ = 25 °C, t = 15 ms
IOL = 10 mA, TJ = 25 °C
IOL = 10 mA
Output switched off, TJ = 25 °C,
VOH = 3.8 V to 24 V
Output switched off, TJ 140 °C,
VOH = 3.8 V to 24 V
VDD = 12 V,
B>Bon + 2 mT or B<Boff 2 mT
VDD = 12 V, RL = 2.4 kΩ, CL = 20 pF
VDD = 12 V, RL = 2.4 kΩ, CL = 20 pF
Fiberglass Substrate
30 mm x 10 mm x 1.5 mm,
pad size see Fig. 3–2
1.80
1.05
1.45
2.90
1.05
0.50
1.50
Fig. 3–2: Recommended pad size SOT89B-2
Dimensions in mm
12
Nov. 30, 2009; DSH000029_002EN
Micronas

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