XE5690SM-1 Surface-Mount Soldering Instructions
The XE5690SM-1 is subject to damage if over-exposed to heat during solder reflow operations.
Following the soldering instructions below will ensure that the process of soldering the module to the
board does not damage the modem.
Maximum Temperature
Maximum Time at 220O C
Maximum Time above Eutectic (180O C)
Maximum Preheat Dwell Time
220O C
20 Seconds
90 Seconds
180 Seconds
Maximum Recommended Solder Temperature Profile
220O C
180O C
150O C
------------------------------180 sec max-------------------------
-20 sec-
max
----- 90 sec max -----
XECOM
(7)
XE5690SM