WED3C7410E16M400BC Ver la hoja de datos (PDF) - White Electronic Designs Corporation

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componentes Descripción

Fabricante

WED3C7410E16M400BC

RISC Microprocessor Multichip Package

White Electronic Designs Corporation 

White Electronic Designs WED3C7410E16M-XBX

PACKAGE DESCRIPTION

Package Outline

Interconnects

Pitch

Maximum module height

Ball diameter

21x25mm

255 (16x16 ball array less one)

1.27mm

3.90mm

0.8mm

PACKAGE DIMENSIONS 255 BALL GRID ARRAY

TOP VIEW

BOTTOM VIEW

T

R

P

N

M

L

K

J

H

G

F

E

D

C

B

A

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

2.20 (0.087)

MAX

NOTES:

1. Dimensions in millimeters and paranthetically in inches.

2. A1 corner is designated with a ball missing the array.

May 2006

Rev. 9

12

White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

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