WED3C7410E16M400BHM Ver la hoja de datos (PDF) - White Electronic Designs Corporation

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Fabricante

WED3C7410E16M400BHM

7410E RISC Microprocessor HiTCE™ Multichip Package

White Electronic Designs Corporation 

White Electronic Designs WED3C7410E16M-XBHX

PRELIMINARY

HITCE™ 255 BALL GRID ARRAY - BH9 PACKAGE (90Pb/10Sn SOLDER BALLS)

TOP VIEW

2.50 (0.098)

BOTTOM VIEW

T

R

P

N

M

L

K

J

H

G

F

E

D

C

B

A

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

NOTES:

1. Dimensions in millimeters and paranthetically in inches.

2. A1 corner is designated with a ball missing the array.

0.762 (0.030)

BSC

0.762 (0.030)

BSC

July 2004

Rev. 0

13

White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

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