W25Q64CV Ver la hoja de datos (PDF) - Winbond

Número de pieza

componentes Descripción

Fabricante

W25Q64CV

3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

Winbond 

8-Pad WSON 6x5mm Cont’d.

W25Q64CV

SYMBOL

M

N

P

Q

R

MILLIMETERS

Min

Nom Max

Min

SOLDER PATTERN

3.40

4.30

6.00

0.50

0.75

INCHES

Nom

0.134

0.169

0.236

0.020

0.026

Max

Notes:

1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications.

2. BSC = Basic lead spacing between centers.

3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.

4. The metal pad area on the bottom center of the package is connected to the device ground (GND pin). Avoid placement of

exposed PCB vias under the pad.

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