W25X10L Ver la hoja de datos (PDF) - Winbond

Número de pieza

componentes Descripción

Fabricante

W25X10L

1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT 2.5V SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI

Winbond 

W25X10L, W25X20L, W25X40L, W25X80L

11. PACKAGE SPECIFICATION

11.1 8-Pin SOIC 150-mil (Package Code SN)

SYMBOL

A

A1

A2

b

C

D(3)

E

E1(3)

e(2)

L

θ

CP

MILLIMETERS

MIN

TYP.

MAX

1.47

1.60

1.72

0.10

---

0.24

---

1.45

---

0.33

0.41

0.50

0.19

0.20

0.25

4.80

4.85

4.95

5.80

6.00

6.19

3.80

3.90

4.00

1.27 BSC

0.40

0o

0.71

---

1.27

8o

---

---

0.10

INCHES

MIN

0.058

0.004

---

0.013

0.0075

0.189

0.228

0.150

0.015

0o

---

TYP.

0.063

---

0.057

0.016

0.008

0.191

0.236

0.154

0.050 BSC

0.028

---

---

MAX

0.068

0.009

---

0.020

0.0098

0.195

0.244

0.157

0.050

8o

0.004

Notes:

1. Controlling dimensions: inches, unless otherwise specified.

2. BSC = Basic lead spacing between centers.

3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.

4. Formed leads shall be planar with respect to one another within .0004 inches at the seating plane.

- 38 -

Publication Release Date: February 27, 2008

Revision I

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