25X10AVIG Ver la hoja de datos (PDF) - Winbond

Número de pieza

componentes Descripción

Fabricante

25X10AVIG

1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI

Winbond 

W25X10A, W25X20A, W25X40A, W25X80A

12. PACKAGE SPECIFICATION

12.1 8-Pin SOIC 150-mil (Package Code SN)

8

5

c

E HE

1

4

D

L

O

0.25

Y

SEATING PLANE

b

SYMBOL

A

A1

b

c

E(3)

D(3)

e(2)

HE

Y(4)

L



A

e

A1

MILLIMETERS

Min

1.35

0.10

0.33

0.19

3.80

4.80

5.80

-

0.40

0°

1.27 BSC

Max

1.75

0.25

0.51

0.25

4.00

5.00

6.20

0.10

1.27

10°

GAUGE PLANE

INCHES

Min

Max

0.053

0.069

0.004

0.010

0.013

0.020

0.008

0.010

0.150

0.157

0.188

0.196

0.050 BSC

0.228

0.244

-

0.016

0.004

0.050

0°

10°

Notes:

1. Controlling dimensions: millimeters, unless otherwise specified.

2. BSC = Basic lead spacing between centers.

3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.

4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.

- 38 -

Share Link: