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25X16BVAIG Ver la hoja de datos (PDF) - Winbond

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25X16BVAIG Datasheet PDF : 47 Pages
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W25X16BV
11.2.18 JEDEC ID (9Fh)
For compatibility reasons, the W25X16BV provides several instructions to electronically determine the
identity of the device. The Read JEDEC ID instruction is compatible with the JEDEC standard for SPI
compatible serial memories that was adopted in 2003.
The instruction is initiated by driving the /CS pin low and shifting the instruction code “9Fh”. The
JEDEC assigned Manufacturer ID byte for Winbond (EFh) and two Device ID bytes, Memory Type
(ID15-ID8) and Capacity (ID7-ID0) are then shifted out on the falling edge of CLK with most significant
bit (MSB) first as shown in figure 20. For memory type and capacity values refer to Manufacturer and
Device Identification table.
Figure 20. Read JEDEC ID
- 31 -
Publication Release Date: October 7, 2009
Preliminary -- Revision C

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