VITESSE
SEMICONDUCTOR CORPORATION
Advance Product Information
VSC7146
2.5Gb/s, 20-Bit Transceiver
Package Thermal Characteristics
The VSC7146 is packaged in an 80-pin, 14mm thermally-enhanced EDQUAD with an internal heat
spreader. These packages use industry-standard EIAJ footprints, which have been enhanced to improve thermal
dissipation. The construction of the packages are as shown in Figure 11. The VSC7146 is designed to operate
with a case temperature up to 90oC. The user must guarantee that the temperature specification is not violated.
Figure 11: Package Cross Section
Exposed Heat Slug
Insulator
Plastic Molding Compound
Lead
Wire Bond
Thermal Epoxy Die
Table 7: Thermal Resistance
Symbol
θjc
θca-0
θca-100
θca-200
θca-400
θca-600
Description
Thermal resistance from junction-to-case
Thermal resistance from case-to-ambient, still air
Thermal resistance from case-to-ambient, 100 LFPM air
Thermal resistance from case-to-ambient, 200 LFPM air
Thermal resistance from case-to-ambient, 400 LFPM air
Thermal resistance from case-to-ambient, 600 LFPM air
Value
2.5
35
29
26
22
19
Units
oC/W
oC/W
oC/W
oC/W
oC/W
oC/W
G52162-0, Rev. 2.7
8/28/00
© VITESSE SEMICONDUCTOR CORPORATION
741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896
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