VN5050JTR-E Ver la hoja de datos (PDF) - STMicroelectronics

Número de pieza

componentes Descripción

Fabricante

VN5050JTR-E

Single channel high side driver for automotive applications

STMicroelectronics 

Package and PCB thermal data

4

Package and PCB thermal data

4.1

PowerSSO-12™ thermal data

Figure 30. PowerSSO-12™ PC Board

VN5050J-E

Note:

Layout condition of Rth and Zth measurements (PCB: Double layer, Thermal Vias, FR4

area= 77mm x 86mm,PCB thickness=1.6mm, Cu thickness=70 µm (front and back side),

Copper areas: from minimum pad lay-out to 8cm2).

Figure 31. Rthj-amb Vs. PCB copper area in open box free air condition

RTHj_amb( °C/ W)

65

60

55

50

45

40

35

0

2

4

6

8

10

PCB Cu heatsink area ( cm^ 2)

24/31

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