VN5050J-E(2006) Ver la hoja de datos (PDF) - STMicroelectronics

Número de pieza

componentes Descripción

Fabricante

VN5050J-E
(Rev.:2006)

Single channel high side driver for automotive applications

STMicroelectronics 

Package and PCB Thermal Data

4

Package and PCB Thermal Data

4.1

PowerSSO-12 Thermal Data

Figure 30. PowerSSO-12 PC Board

VN5050J-E

18/23

Layout condition of Rth and Zth measurements (PCB: Double layer, Thermal Vias, FR4 area= 77mm x 86mm,

PCB thickness=1.6mm, Cu thickness=70µm (front and back side), Copper areas: from minimum pad lay-out to 8cm2).

Figure 31. Rthj-amb Vs. PCB copper area in open box free air condition

RTHj_amb(°C/W)

70

65

60

55

50

45

40

0

2

4

6

8

10

PCB Cu heatsink area (cm^2)

Figure 32. PowerSSO-12 Thermal Impedance Junction Ambient Single Pulse

ZTH (°C/W)

1000

100

10

Footprint

2 cm2

8 cm2

1

0.1

0.0001 0.001 0.01

0.1

1

Time (s)

Pulse Calculation Formula

ZTHδ = RTH ⋅ δ + ZTHtp(1 – δ)

where δ = tP/T

10 100 1000

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