UPD784031A Ver la hoja de datos (PDF) - NEC => Renesas Technology

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UPD784031A

16-/8-BIT SINGLE-CHIP MICROCONTROLLERS

NEC => Renesas Technology 

µPD784031

Table 16-1. Soldering Conditions for Surface-Mount Devices (2/2)

(3) µPD784031GK-BE9: 80-pin plastic TQFP (fine pitch) (12 × 12 mm)

Soldering process

Infrared ray reflow

VPS

Partial heating method

Soldering conditions

Symbol

Peak package’s surface temperature: 235 °C

Reflow time: 30 seconds or less (210 °C or more)

Maximum allowable number of reflow processes: 2

Exposure limit: 7 daysNote (10 hours of pre-baking is required at 125 °C

afterward)

<Caution>

Non-heat-resistant trays, such as magazine and taping trays, cannot be

baked before unpacking.

IR35-107-2

Peak package’s surface temperature: 215 °C

Reflow time: 40 seconds or less (200 °C or more)

Maximum allowable number of reflow processes: 2

Exposure limit: 7 daysNote (10 hours of pre-baking is required at 125 °C

afterward)

<Caution>

Non-heat-resistant trays, such as magazine and taping trays, cannot be

baked before unpacking.

VP15-107-2

Terminal temperature: 300 °C or less

-

Heat time: 3 seconds or less (for one side of a device)

Note Maximum number of days during which the product can be stored at a temperature of 25 °C and a relative

humidity of 65 % or less after dry-pack package is opened.

Caution Do not apply two or more different soldering methods to one chip (except for partial heating

method for terminal sections).

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