UPD75236GJ Ver la hoja de datos (PDF) - NEC => Renesas Technology

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UPD75236GJ

4-BIT SINGLE-CHIP MICROCOMPUTER

NEC => Renesas Technology 

µPD75236

14. RECOMMEDED SOLDERING CONDITIONS

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The µPD75236 should be soldered and mounted under the conditions recommended in the table below.

For soldering methods and conditions other than those recommended below, contact our salesman.

Table 14-1 List of Recommended Soldering Conditions

Product Name

µPD75236GJ-×××-5BG

Package

94-pin plastic QFP

Recommended Condition Symbol

WS60-107-1

IR30-107-1

VP15-107-1

Pin part heating

Table 14-2 Soldering Conditions

Recommended

Condition Symbol

Soldering Method

WS60-107-1

Wave Soldering

IR30-107-1

Infrared reflow

VP15-107-1

VPS

Pin part heating

Pin part heating

Soldering Conditions

Solder bath temperature: 260°C or less

Duration: 10 sec. max.

Number of times: Once

Time limit: 7 days* (thereafter 10 hours prebaking required at 125°C)

Preheating temperature: 120°C max. (package surface temperature)

Package peak temperature: 230°C

Duration: 30 sec. max. (at 210°C or above)

Number of times: Once

Time limit: 7 days* (thereafter 10 hours prebaking required at 125°C)

Package peak temperature: 215°C

Duration: 40 sec. max. (at 200°C or above)

Number of times: Once

Time limit: 7 days* (thereafter 10 hours prebaking required at 125°C)

Pin part temperature: 300°C or less

Duration: 3 sec. max. (Per device side)

* For the storage period after dry-pack decompression, storage conditions are max. 25°C, 65% RH.

Note Use of more than one soldering method should be avoided (except in the case of pin part heating).

Remarks For details of recommended soldering conditions for the surface mounting type, refer to the docu-

ment “Semiconductor Device Mount Technology” (IEI-1207).

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