UPD3725AD Ver la hoja de datos (PDF) - NEC => Renesas Technology
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UPD3725AD Datasheet PDF : 22 Pages
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µPD3725A
RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering
processes are used, or if the soldering is performed under different conditions, please make sure to consult with our
sales offices.
For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUALâ€
(C10535E).
Type of Through Hole Device
µPD3725AD : CCD linear image sensor 24-pin ceramic DIP (600 mil)
Process
Wave soldering (only to leads)
Partial heating method
Conditions
Solder temperature: 260 °C or below,
Flow time: 10 seconds or less.
Pin temperature: 260 °C or below,
Heat time: 10 seconds or less (Per each lead).
Caution For through hole devices, the wave soldering process must be applied only to leads, and make
sure that the package body does not get jet soldered.
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