UPD3777 Ver la hoja de datos (PDF) - NEC => Renesas Technology
Número de pieza
componentes Descripción
Fabricante
UPD3777 Datasheet PDF : 20 Pages
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µ PD3777
RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below.
If other soldering processes are used, or if the soldering is performed under different conditions, please make sure to
consult with our sales offices.
For more details, refer to our document “Semiconductor Device Mounting Technology Manual” (C10535E).
Type of Through-hole Device
µ PD3777CY : CCD linear image sensor 22-pin plastic DIP (10.16 mm (400))
Process
Conditions
Partial heating method
Pin temperature : 300 °C or below, Heat time : 3 seconds or less (per pin)
Caution During assembly care should be taken to prevent solder or flux from contacting the plastic cap. The
optical characteristics could be degraded by such contact.
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Data Sheet S14583EJ1V0DS00
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