UPD16781 Ver la hoja de datos (PDF) - NEC => Renesas Technology

Número de pieza

componentes Descripción

Fabricante

UPD16781

480 OUTPUT TFT-LCD SOURCE DRIVER

NEC => Renesas Technology 

µ PD16781

9. RECOMMENDED MOUNTING CONDITIONS

The following conditions must be met for mounting conditions of the µ PD16781.

For more details, refer to the Semiconductor Device Mounting Technology Manual (C10535E).

Please consult with our sales offices in case other mounting process is used, or in case the mounting is done under

different conditions.

µ PD16781N-xxx: TCP (TAB Package)

Mounting Condition

Mounting Method

Thermocompression

Soldering

ACF

(Adhesive Conductive

Film)

Condition

Heating tool 300 to 350°C, heating for 2 to 3 sec, pressure 100g (per

solder).

Temporaly bonding 70 to 100°C, pressure 3 to 8 kg/cm2, time 3 to 5 sec.

Real bonding 165 to 180°C, pressure 25 to 45 kg/cm2, time 30 to 40 sec

(When using the anisotropy conductive film SUMIZAC1003 of Sumitomo

Bakelite, Ltd).

Caution To find out the detailed conditions for mounting the ACF part, please contact the ACF manufacturing

company. Be sure to avoid using two or more mounting methods at a time.

14

DataSheet S14634EJ1V0DS

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