UPD120NXX Ver la hoja de datos (PDF) - NEC => Renesas Technology

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Fabricante

UPD120NXX

THREE-TERMINAL LOW-DROPOUT POSITIVE-VOLTAGE REGULATOR (OUTPUT CURRENT: 0.3 A)

NEC => Renesas Technology 

µPD120Nxx Series

RECOMMENDED SOLDERING CONDITIONS

The µ PD120Nxx series should be soldered and mounted under the following recommended conditions.

For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales

representative.

For technical information, see the following website.

Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)

Type of Surface Mount Device

µ PD120N15TA, µ PD120N18TA, µ PD120N25TA, µ PD120N33TA: SC-74A

µ PD120N15T1B, µ PD120N18T1B, µ PD120N25T1B, µ PD120N33T1B: SC-62

Process

Conditions

Infrared Ray Reflow

Peak temperature: 235°C or below (Package surface temperature),

Reflow time: 30 seconds or less (at 210°C or higher),

Maximum number of reflows processes: 3 times or less.

Vapor Phase Soldering

Peak temperature: 215°C or below (Package surface temperature),

Reflow time: 40 seconds or less (at 200°C or higher),

Maximum number of reflows processes: 3 times or less.

Wave Soldering

Solder temperature: 260°C or below, Flow time: 10 seconds or less,

Maximum number of flow processes: 1 time,

Pre-heating temperature: 120°C or below (Package surface temperature).

Partial Heating Method

Pin temperature: 300°C or below,

Heat time: 3 seconds or less (Per each side of the device).

Symbol

IR35-00-3

VP15-00-3

WS60-00-1

–

µ PD120N15TA-A, µ PD120N18TA-A, µ PD120N25TA-A, µ PD120N33TA-A: SC-74A Note1

µ PD120N15T1B-AZ, µ PD120N18T1B-AZ, µ PD120N25T1B-AZ, µ PD120N33T1B-AZ: SC-62 Note2

Process

Conditions

Infrared Ray Reflow

Peak temperature: 260°C or below (Package surface temperature),

Reflow time: 30 seconds or less (at 210°C or higher),

Maximum number of reflows processes: 3 times or less.

Wave Soldering

Solder temperature: 260°C or below, Flow time: 10 seconds or less,

Maximum number of flow processes: 1 time,

Pre-heating temperature: 120°C or below (Package surface temperature).

Partial Heating Method

Pin temperature: 300°C or below,

Heat time: 3 seconds or less (Per each side of the device).

Symbol

IR60-00-3

WS60-00-1

–

Notes 1. Pb-free (This product does not contain Pb in external electrode and other parts.)

2. Pb-free (This product does not contain Pb in external electrode.)

Caution Do not use different soldering methods together (except for partial heating).

Remark Flux: Rosin-based flux with low chlorine content (chlorine 0.2 Wt% or below) is recommended.

Data Sheet S17145EJ2V0DS

13

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