UPC8103 Ver la hoja de datos (PDF) - NEC => Renesas Technology
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UPC8103 Datasheet PDF : 26 Pages
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µPC8103T, µPC8108T
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to maintain the minimum ground impedance (to prevent
undesired oscillation).
(3) Keep the wiring length of the ground pins as short as possible.
(4) Connect a bypass capacitor (eg 1 000 pF) to the Vcc pin.
(5) Insert the inductor (eg L = 150 µH) between 5 and 6 pins.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering methods
and conditions than the recommended conditions are to be consulted with our sales representatives.
µPC8103T, µPC8108T
Soldering process
Soldering conditions
Infrared ray reflow
VPS
Wave soldering
Pin part heating
Package peak temperature: 235 ˚C, Hour: within 30 s. (more than 210 ˚C),
Time: 2 time, Limited days: no.Note
Package peak temperature: 215 ˚C, Hour: within 40 s. (more than 200 ˚C),
Time: 2 time, Limited days: no.Note
Soldering tub temperature: less than 260 ˚C, Hour: within 10 s.
Time: 1 time, Limited days: no.Note
Pin area temperature: less than 300 ˚C, Hour: within 10 s.
Limited days: no.Note
Recommended
condition symbol
IR35-00-2
VP15-00-2
WS60-00-1
Note It is the storage days after opening a dry pack, the storage conditions are 25 ˚C, less than 65 % RH.
Caution The combined use of soldering method is to be avoided (However, except the pin area heating
method).
For details of recommended soldering conditions for surface mounting, refer to information
document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (IEI-1207)
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