UPC8102 Ver la hoja de datos (PDF) - NEC => Renesas Technology
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UPC8102 Datasheet PDF : 20 Pages
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µPC8102T
NOTE ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation).
(3) Keep the track length of the ground pins as short as possible.
(4) The bypass capacitor (eg 1 000 pF) should be attached to the VCC pin.
(5) The matching circuit must be each attached to input and output pins.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering methods and conditions
than the recommended conditions are to be consulted with our sales representatives.
µPC8102T
Soldering process
Infrared ray reflow
VPS
Wave Soldering
Pin part heating
Soldering conditions
Package peak temperature: 235 ˚C,
Hour: within 30 s. (more than 210 ˚C),
Time: 3 time, Limited days: no.*
Package peak temperature: 215 ˚C,
Hour: within 40 s. (more than 200 ˚C),
Time: 3 time, Limited days: no.*
Soldering tub temperature: less than 260 ˚C, Hour: within 10 s.
Time: 1 time, Limited days: no.*
Pin area temperature: less than 300 ˚C, Hour: within 3 s/pin.
Limited days: no.*
Recommended condition
symbol
IR35-00-3
VP15-00-3
WS60-00-1
* It is the storage days after opening a dry pack, the storage conditions are 25 ˚C, less than 65 % RH.
Note The combined use of soldering method is to be avoided (However, except the pin area heating method).
For details of recommended soldering conditions for surface mounting, refer to information document SEMICON-
DUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535EJ7V0IF00).
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