PACKAGE FN
TOP VIEW
PIN 1
2000
+ 75
END VIEW
BOTTOM VIEW
MECHANICAL DATA
TSL2580, TSL2581
LIGHT-TO-DIGITAL CONVERTER
TAOS098 − MARCH 2010
Dual Flat No-Lead
2000 + 75
Vdd 1
ADDR SEL 2
GND 3
PIN OUT
TOP VIEW
6 SDA
5 INT
4 SCL
Photo-Active Area
650 + 50
Seating Plane
SIDE VIEW
203 + 8
650
300
+ 50
650
PIN 1
300 + 50
Pb
750 + 150
Lead Free
NOTES: A. All linear dimensions are in micrometers. Dimension tolerance is ± 20 μm unless otherwise noted.
B. The photodiode active area is 466 μm square and its center is 140 μm above and 20 μm to the right of the package center. The die
placement tolerance is ± 75 μm in any direction.
C. Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
D. Contact finish is copper alloy A194 with pre-plated NiPdAu lead finish.
E. This package contains no lead (Pb).
F. This drawing is subject to change without notice.
Figure 20. Package FN — Dual Flat No-Lead Packaging Configuration
The LUMENOLOGY r Company
r
Copyright E 2010, TAOS Inc.
r
www.taosinc.com
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