TPS856 Ver la hoja de datos (PDF) - Toshiba

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componentes Descripción

Fabricante

TPS856

TOSHIBA Photo-IC Silicon Epitaxial Planar

Toshiba 

TPS856

• Second reflow soldering

In case of second reflow soldering, it should be performed within 168 h after first reflow under the

above conditions.

Storage conditions before second reflow soldering: 30°C, 70% RH or lower

• Do not perform flow soldering.

• Make any necessary soldering correction manually.

(Do not do this more than once for any given pin.)

Temperature: no more than 350°C (25 W for soldering iron)

Time: within 5 s

(2) Recommended soldering pattern

Unit: mm

0.3

1.0

0.5 0.5

(3) Cleaning conditions

When cleaning is required after soldering

Chemicals: AK225 alcohol

Temperature and time: 50°C × 30 s or 30°C × 3 min

Ultrasonic cleaning: 300 W or less

Packing Specification

(1) Packing quantity

Reel (minimum packing quantity)

Carton

3,000 devices

5 reels (15,000 devices)

(2) Packing format

Silica gel and reel are packed into sealed aluminum envelope.

Pack shock-absorbent materials around the aluminum envelopes in the cartons to cushion them.

• Carton specification

Label

Carton dimensions

(W) 81 mm × (L) 280 mm × (H) 280 mm

6

2007-10-01

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