TLP118TPL Ver la hoja de datos (PDF) - Toshiba

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componentes Descripción

Fabricante

TLP118TPL

TOSHIBA PHOTOCOUPLER GaAℓAs Ired & PHOTO-IC

Toshiba 

TLP118

Absolute Maximum Ratings (Ta=25°C)

CHARACTERISTIC

SYMBOL RATING UNIT

Forward Current

IF

25

mA

Forward Current Derating (Ta ≥ 110°C)

ΔIF /°C

-0.67

mA/°C

Pulse Forward Current

(Note 1)

IFP

50

mA

Pulse Forward Current Derating (Ta ≥ 110°C)

ΔIFP /°C

-1.34

mA/°C

Reverse Voltage

VR

5

V

Output Current 1 (Ta ≤ 125℃)

IO

25

mA

Output Voltage

VO

6

V

Supply Voltage

VCC

6

V

Output Power Dissipation

PO

80

mW

Output Power Dissipation Derating (Ta ≥ 110°C)

ΔPO /°C

-2.0

mW/°C

Operating Temperature Range

Topr

-40 to 125 °C

Storage Temperature Range

Tstg

-55 to 125 °C

Lead Soldering Temperature (10 s)

Tsol

260

°C

Isolation Voltage (AC,1 min.,R.H.≤ 60%,Ta=25°C)

(Note 2)

BVs

3750

Vrms

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even

if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum

ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Note 1: Pulse width ≤ 1ms, duty = 50%.

Note 2: This device is regarded as a two terminal device: pins 1 and 3 are shorted together,

as are pins 4, 5 and 6.

Recommended Operating Conditions

CHARACTERISTIC

Input Current , High Level

Input Voltage , Low Level

Supply Voltage*

Operating Temperature

SYMBOL MIN TYP. MAX UNIT

IFH

7.5

-

15

mA

VFL

0

-

0.8

V

VCC

4.5

-

5.5

V

Topr

-40

-

125

°C

* This item denotes operating range, not meaning of recommended operating conditions.

Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the

device. Additionally, each item is an independent guideline respectively. In developing designs using this

product, please confirm specified characteristics shown in this document.

2

2010-03-02

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