Advance Product Information
July 14, 2005
TGA2511
Recommended Chip Assembly Diagram
Option 1: Self Bias - No Gain Control
Vd
RF In
100pF
RF Out
All DC connections may be brought in from either side of the chip (Use Pad 6 or 8)
0.01uF external Cap is recommended on Drain
Bias: Vd = 5V (Id = ~80mA)
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
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TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com