TEA1523P Ver la hoja de datos (PDF) - NXP Semiconductors.

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componentes Descripción

Fabricante

TEA1523P

SMPS ICs for low-power systems

NXP Semiconductors. 

NXP Semiconductors

TEA152x

SMPS ICs for low-power systems

SO14: plastic small outline package; 14 leads; body width 3.9 mm

SOT108-1

D

y

Z

14

pin 1 index

1

e

E

A

X

c

HE

vM A

8

A2

A1

7

bp

wM

Q

(A 3)

A

θ

Lp

L

detail X

0

2.5

5 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

UNIT max. A1

A2

A3

bp

c

D(1) E(1)

e

HE

L

Lp

Q

v

w

y

Z (1)

θ

mm

1.75

0.25

0.10

1.45

1.25

0.25

0.49

0.36

0.25

0.19

8.75

8.55

4.0

3.8

1.27

6.2

5.8

1.05

1.0

0.4

0.7

0.6

0.25 0.25

0.1

0.7

0.3

8o

inches

0.069

0.010

0.004

0.057

0.049

0.01

0.019 0.0100 0.35

0.014 0.0075 0.34

0.16

0.15

0.05

0.244

0.228

0.041

0.039

0.016

0.028

0.024

0.01

0.01

0.004

0.028

0.012

0o

Note

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

OUTLINE

VERSION

SOT108-1

IEC

076E06

REFERENCES

JEDEC

JEITA

MS-012

EUROPEAN

PROJECTION

ISSUE DATE

99-12-27

03-02-19

Fig 8. Package outline SOT108-1 (SO14)

TEA152X

Product data sheet

All information provided in this document is subject to legal disclaimers.

Rev. 04 — 14 September 2010

© NXP B.V. 2010. All rights reserved.

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