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HTSSOP32 Ver la hoja de datos (PDF) - NXP Semiconductors.

Número de pieza
componentes Descripción
Fabricante
HTSSOP32
NXP
NXP Semiconductors. NXP
HTSSOP32 Datasheet PDF : 48 Pages
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NXP Semiconductors
15. Package outline
SO32: plastic small outline package; 32 leads; body width 7.5 mm
TDA8932B
Class-D audio amplifier
SOT287-1
D
y
Z
32
pin 1 index
1
e
E
A
X
c
HE
vM A
17
A2
A1
16
wM
bp
Q
(A 3)
A
θ
Lp
L
detail X
0
5
scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
UNIT max. A1
A2
A3
bp
c
D(1) E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
2.65 0.3 2.45 0.25 0.49 0.27 20.7
0.1 2.25
0.36 0.18 20.3
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.2
1.0
0.25 0.25
0.1
0.95
0.55
8o
inches
0.1 0.012 0.096 0.01
0.004 0.089
0.02 0.011 0.81
0.01 0.007 0.80
0.30
0.29
0.05
0.419
0.394
0.055
0.043
0.016
0.047
0.039
0.01
0.01
0.004
0.037
0.022
0o
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
OUTLINE
VERSION
IEC
SOT287-1
REFERENCES
JEDEC
JEITA
MO-119
EUROPEAN
PROJECTION
ISSUE DATE
00-08-17
03-02-19
Fig 40. Package outline SOT287-1 (SO32)
TDA8932B_4
Product data sheet
Rev. 04 — 18 December 2008
© NXP B.V. 2008. All rights reserved.
41 of 48

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