NXP Semiconductors
TDA1308; TDA1308A
Class-AB stereo headphone driver
temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 16. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
TDA1308_A_4
Product data sheet
Rev. 04 — 25 January 2007
© NXP B.V. 2007. All rights reserved.
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