NXP Semiconductors
TDA1308; TDA1308A
Class-AB stereo headphone driver
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm
SOT505-1
D
c
y
Z
8
5
E
A
X
HE
vM A
pin 1 index
1
e
4
bp
wM
A2 A1
(A3)
A
θ
Lp
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1) E(2)
e
HE
L
Lp
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.45
0.25
0.28
0.15
3.1
2.9
3.1
2.9
0.65
5.1
4.7
0.94
0.7
0.4
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOT505-1
v
w
y
Z(1)
θ
0.1
0.1
0.1
0.70
0.35
6°
0°
EUROPEAN
PROJECTION
ISSUE DATE
99-04-09
03-02-18
Fig 14. Package outline SOT505-1 (TSSOP8)
TDA1308_A_4
Product data sheet
Rev. 04 — 25 January 2007
© NXP B.V. 2007. All rights reserved.
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