87C196LB Ver la hoja de datos (PDF) - Intel

Número de pieza

componentes Descripción

Fabricante

87C196LB

CHMOS 16-BIT MICROCONTROLLER

Intel 

®

AUTOMOTIVE

6.0 THERMAL CHARACTERISTICS

All thermal impedance data is approximate for static air conditions at 1 watt of power dissipation. Values will

change depending on operating conditions and the application. The Intel Packaging Handbook (order number

240800) describes Intel’s thermal impedance test methodology. The Components Quality and Reliability

Handbook (order number 210997) provides quality and reliability information.

Table 8. Thermal Characteristics

Package Type

AN87C196LB (52-pin PLCC)

θJA

42°C/W

θJC

15°C/W

NOTES:

1. θJA = Thermal resistance between junction and the surrounding environment (ambient). Measure-

ments are taken 1 ft. away from case in static air flow environment.

θJC = Thermal resistance between juction and package surface (case).

2. All values of θJA and θJC may fluctuate depending on the environment (with or without airflow, and

how much airflow) and device power dissipation at temperature of operation. Typical variations are

± 2°C/W.

3. Values listed are at a maximum power dissipation of 0.50 W.

7.0 DESIGN CONSIDERATIONS

To be supplied.

8.0 DEVICE ERRATA

There is no known device errata at this time.

9.0 DATASHEET REVISION HISTORY

This datasheet is valid for devices with an “A” at the end of the topside field process order (FPO) number.

Datasheets are changed as new device information becomes available. Verify with your local Intel sales office

that you have the latest version before finalizing a design or ordering devices.

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