TC647 Ver la hoja de datos (PDF) - Microchip Technology
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TC647 Datasheet PDF : 28 Pages
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TC647
6.2 8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
p
E
E1
B
n
D
2
1
c
(F)
A
A2
A1
L
Units
Dimension Limits
Number of Pins
n
Pitch
p
Overall Height
A
Molded Package Thickness
A2
Standoff §
A1
Overall Width
E
Molded Package Width
E1
Overall Length
D
Foot Length
L
Footprint (Reference)
F
Foot Angle
Lead Thickness
c
Lead Width
B
Mold Draft Angle Top
Mold Draft Angle Bottom
*Controlling Parameter
§ Significant Characteristic
INCHES
MIN
NOM
8
.026
.030
.002
.184
.114
.114
.016
.035
0
.004
.010
.034
.193
.118
.118
.022
.037
.006
.012
7
7
MAX
.044
.038
.006
.200
.122
.122
.028
.039
6
.008
.016
MILLIMETERS*
MIN
NOM
0.65
0.76
0.05
4.67
2.90
2.90
0.40
0.90
0
0.10
0.25
0.86
4.90
3.00
3.00
0.55
0.95
0.15
0.30
7
7
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed. 010" (0.254mm) per side.
MAX
8
1.18
0.97
0.15
.5.08
3.10
3.10
0.70
1.00
6
0.20
0.40
Drawing No. C04-111
DS21447D-page 20
2001-2012 Microchip Technology Inc.
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