TC2014 Ver la hoja de datos (PDF) - Microchip Technology
Número de pieza
componentes Descripción
Fabricante
TC2014 Datasheet PDF : 20 Pages
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TC2014/2015/2185
Note: Unless otherwise indicated, VIN = VR + 1V, IL = 100 µA, COUT = 3.3 µF, SHDN > VIH, TA = +25°C.
FIGURE 2-19:
(COUT = 1 µF).
Line Transient Response.
100mV/DIV
VOUT
150mA
VIN = 3.105V
VOUT = 3.006V
CIN = 1 μF Ceramic
COUT = 10 μF Ceramic
RLOAD = 20 Ω
100mA
FIGURE 2-20:
Load Transient Response in
Dropout. (COUT = 10 µF).
FIGURE 2-21:
Shutdown Delay Time.
FIGURE 2-22:
Wake-Up Response.
0
-10
-20
VIN = 4.0V
VINAC = 100 mV
VOUTDC = 3.0V
COUT = 1µF Ceramic
CBYPASS = 0.01 µF Ceramic
-30
IOUT = 150 mA
-40 IOUT = 100 mA
-50
-60
-70
10
IOUT = 50 mA
100 110k00 10100k0 101000k0 1010M000
0
Frequency (Hz)
FIGURE 2-23:
PSRR vs. Frequency
(COUT = 1 µF Ceramic).
0
-10
-20
VIN = 4.0V
VINAC = 100 mV
VOUTDC = 3.0V
COUT = 10 µF Ceramic
CBYPASS = 0.01 µF Ceramic
-30
IOUT = 150 mA
-40
IOUT = 100 mA
-50
-60
-70
1100
100 110k00 11000k00 11000k00 1010M000
0
Frequency (Hz)
FIGURE 2-24:
PSRR vs. Frequency
(COUT = 10 µF Ceramic).
2001-2012 Microchip Technology Inc.
DS21662F-page 7
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