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TAT7461 Ver la hoja de datos (PDF) - TriQuint Semiconductor

Número de pieza
componentes Descripción
Fabricante
TAT7461
TriQuint
TriQuint Semiconductor TriQuint
TAT7461 Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
Package Marking and Dimensions
Marking: Part number TAT7461
Lot code XXXXYYWW
D
A
D1
TAT7461
75 Ohm RF Amplifier 50 1000 MHz
D1
HALF ETCHING
DEPTH 0.001"
D1
TAT7461
E
E1
XXXXYYWW
H
L
B
2X B1
C
e
e1
Notes:
1. All dimensions are in millimeters. Angles are in degrees.
Alternate Backside Patterns - Reflow Compatible
(Part may be supplied with either pattern)
SYMBOL
A
B
B1
C
D
D1
MIN
1.40
(.055)
.44
(.017)
.36
(.014)
.35
(.014)
4.40
(.173)
1.62
(.064)
TYP
1.50
(.059)
.50
(.020)
.42
(.0165)
.40
(.016)
4.50
(.177)
1.73
(.068)
MAX
1.60
(.063)
.56
(.022)
.48
(.019)
.44
(.017)
4.60
(.181)
1.83
(.072)
SYMBOL
E
E1
e
e1
H
L
MIN
2.29
(.090)
2.13
(.084)
3.94
(.155)
.89
(.035)
TYP
2.50
(.098)
2.20
(.087)
1.50 BSC
(.059)
3.00 BSC
(.118)
4.10
(.161)
1.10
(.043)
MAX
2.60
(.102)
2.29
(.090)
4.25
(.167)
1.20
(.047)
PCB Mounting Pattern
Notes:
1. All dimensions are in millimeters. Angles are in degrees.
2. Use 1 oz. copper minimum for top and bottom layer metal.
3. Vias are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation.
4. We recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25 mm (0.10”).
5. Ensure good package backside paddle solder attach for reliable operation and best electrical performance.
Datasheet: Rev D 09-08-14
© 2014 TriQuint
- 6 of 7 -
Disclaimer: Subject to change without notice
www.triquint.com

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