STV7733BMP Ver la hoja de datos (PDF) - STMicroelectronics
Número de pieza
componentes Descripción
Fabricante
STV7733BMP Datasheet PDF : 28 Pages
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STV7733
Pad dimensions (in microns)/pad positions
Table 9. Pad placement and bump dimensions (in microns) (continued)
Lead pad name
Pad placements
X
Y
Bump dimensions(1)
X
Y
OUT302
-9621.9
600.6
51.0
73.1
OUT301
-9553.9
600.6
51.0
73.1
OUT300
-9485.9
600.6
51.0
73.1
OUT299
-9417.9
600.6
51.0
73.1
OUT298
-9349.9
600.6
51.0
73.1
OUT297
-9281.9
600.6
51.0
73.1
OUT296
-9213.9
600.6
51.0
73.1
OUT295
-9145.9
600.6
51.0
73.1
OUT294
-9077.9
600.6
51.0
73.1
OUT293
-9009.9
600.6
51.0
73.1
OUT292
-8941.9
600.6
51.0
73.1
OUT291
-8873.9
600.6
51.0
73.1
OUT290
-8805.9
600.6
51.0
73.1
OUT289
-8737.9
600.6
51.0
73.1
OUT288
-8669.9
600.6
51.0
73.1
OUT287
-8601.9
600.6
51.0
73.1
OUT286
-8533.9
600.6
51.0
73.1
OUT285
-8465.9
600.6
51.0
73.1
OUT284
-8397.9
600.6
51.0
73.1
OUT283
-8329.9
600.6
51.0
73.1
OUT282
-8261.9
600.6
51.0
73.1
OUT281
-8193.9
600.6
51.0
73.1
OUT280
-8125.9
600.6
51.0
73.1
OUT279
-8057.9
600.6
51.0
73.1
OUT278
-7989.9
600.6
51.0
73.1
OUT277
-7921.9
600.6
51.0
73.1
OUT276
-7853.9
600.6
51.0
73.1
OUT275
-7785.9
600.6
51.0
73.1
OUT274
-7717.9
600.6
51.0
73.1
OUT273
-7649.9
600.6
51.0
73.1
OUT272
-7581.9
600.6
51.0
73.1
OUT271
-7513.9
600.6
51.0
73.1
OUT270
-7445.9
600.6
51.0
73.1
15/28
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