Characteristics
STPS41H100C
Figure 7.
Reverse leakage current versus
reverse voltage applied
(typical values)
IR(mA)
1.E+02
1.E+01
1.E+00
1.E-01
1.E-02
Tj=150°C
Tj=125°C
Tj=100°C
Tj=75°C
Tj=50°C
Figure 8.
C(nF)
10.0
Junction capacitance versus
reverse voltage applied
(typical values)
F=1MHz
Vosc =30mV
Tj=25°C
1.0
1.E-03
1.E-04
0
10 20 30
Tj=25°C
VR(V)
40 50 60 70 80 90 100
0.1
1
VR(V)
10
100
Figure 9. Forward voltage drop versus
forward current
IFM(A)
100
Tj=125°C
(Maximum values)
10
Tj=125°C
(Typical values)
Tj=25°C
(Maximum values)
VFM(V)
1
0.0
0.2
0.4
0.6
0.8
1.0
Figure 10. Thermal resistance junction to
ambient versus copper surface
under tab
Rth(j-a)(°C/W)
80
(epoxy printed board FR4, Cu = 35 µm) - STPS41H100CG only
70
60
50
40
30
20
10
0
1.2
0
S(cm²)
5
10
15
20
25
30
35
40
4/9
Doc ID 8613 Rev 5