STPR1620CG / STPR1620CT / STPR1620CR
Fig. 7: Junction capacitance versus reverse
voltage applied (typical values, per diode).
Fig. 8: Recovery charges versus dIF/dt (per
diode).
H
Fig. 9: Peak reverse current versus dIF/dt (per
diode).
Fig. 10: Dynamic parameters versus junction
temperature (per diode).
Fig. 11: Thermal resistance junction to ambient
versus copper surface under tab (epoxy printed
circuit board, CU = 35µs) (STPR1620CG only).
Rth(j-a) (°C/W)
80
70
60
50
40
30
20
10
0
0246
S(Cu) (cm²)
8 10 12 14 16 18 20
4/7