STP08DP05XTTR Ver la hoja de datos (PDF) - STMicroelectronics
Número de pieza
componentes Descripción
Fabricante
STP08DP05XTTR
STMicroelectronics
STP08DP05XTTR Datasheet PDF : 32 Pages
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Typical characteristics
STP08DP05
Table 11. ISET vs. drop out voltage (VDROP)
Vdd
I set
Rext
Vdrop min
Vdrop max
Vdrop AVG
(V)
(mA)
()
(mV)
(mV)
(mV)
3
6470
30.6
31.2
30.93
5
3930
46.5
52.9
48.63
10
1910
80.9
100
82.26
3
20
963
150
161
157
50
386
392
396
394.3
80
241
636
646
640.3
100
192
846
850
848
3
6470
25.6
29
26.96
5
3930
40.8
41.7
41.16
10
1910
80.1
105
89.2
5
20
963
153
154
154
50
386
379
386
382
80
241
618
626
621
100
192
825
830
827
Figure 13. Power dissipation vs. temperature package
Note:
The exposed-pad should be soldered to the PBC to realize the thermal benefits.
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DocID13405 Rev 6
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